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MC13892DJVLR2|NXP|simage
MC13892DJVLR2|NXP|limage
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PMIC Solutions

MC13892DJVLR2

PMIC Solution to 186-Pin BGA T/R

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Unconfirmed
  • HTS
    8542.39.00.60
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Mounting
    Surface Mount
  • Package Height
    1.18 mm
  • Package Width
    12 mm
  • Package Length
    12 mm
  • PCB changed
    186
  • Standard Package Name
    BGA
  • Supplier Package
    BGA
  • Pin Count
    186
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources