MK66FN2M0VMD18|NXP|simage
MK66FN2M0VMD18|NXP|limage
Microcontrollers - MCUs

MK66FN2M0VMD18

MCU 32-bit ARM Cortex M4 RISC 2MB Flash 2.5V/3.3V 144-Pin MAP-BGA Tray Automotive AEC-Q100

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991a.2.
  • Part Status
    Active
  • HTS
    8542.31.00.25
  • SVHC
    Yes
  • Automotive
    Yes
  • PPAP
    Yes
  • Mounting
    Surface Mount
  • Package Height
    1.27(Max) mm
  • Package Width
    13 mm
  • Package Length
    13 mm
  • PCB changed
    144
  • Standard Package Name
    BGA
  • Supplier Package
    MAP-BGA
  • Pin Count
    144
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources