Connector solutions addressing the development trends of the automotive industry

Rising adoption of automotive electronics drives demand for electronic connectors

The U.S. automotive electronics market is valued at $249.6 billion and is projected to grow to $391.4 billion by 2033, representing a Compound Annual Growth Rate (CAGR) of 4.6% over the next decade. It bears repeating that this $390+ billion market refers solely to the United States. Clearly, the increasing prevalence of electronics in vehicles will lead to a corresponding rise in the number of electronic connectors.
 
USCAR and LV214 are standards for automotive connector systems. However, both primarily apply to cable-to-cable and cable-to-board connector systems. With the emergence and growth of software-defined vehicles (SDVs), designers and industry experts predict that vehicles will incorporate more board-to-board (i.e., PCB level) connectors.
 
A significant change involves replacing the electronic control units (ECUs) with a "central computer" within the vehicle. In conventional vehicles, ECUs are small "boxes," each managing a specific vehicle function. For instance, one ECU controls headlights, another handles window operation, another manages seat controls, another oversees the comfort system, and so on. A typical vehicle may contain 40 or more ECUs, while a high-end luxury car could have 150 or more, all of which need integration into the vehicle's electronic system and driver interface.
 
Conversely, SDVs utilize a central computer to assume the functions of traditional ECUs. Since software now governs the functionality of individual components, updates no longer require the physical replacement or swapping of components within the vehicle. Connector requirements for embedded computers differ from those of ECUs. Differences include the addition of two-piece board-to-board connectors (i.e., mating socket and terminal sets); higher pin counts to accommodate the sheer volume of signals, power, and grounds being processed; and the likely use of more surface-mount technology (SMT) connector devices to conserve valuable PCB space. Despite these changes, connectors for automotive computers must still meet numerous requirements, such as withstanding high shock/vibration and extreme environmental conditions.

Rugged, high-performance interconnect solutions for automotive applications

Samtec offers a wide range of rugged, high-performance interconnect solutions designed for automotive applications. It provides Sudden Service® solutions to meet both standard and customer-specific automotive design needs, featuring short lead times and a variety of options to satisfy rigorous customer requirements regarding quality, production, and compliance. Samtec's automotive interconnect systems are ideal for applications demanding high performance, high density, high reliability/high mating cycles, optical and microelectronic solutions, and come with Production Part Approval Process (PPAP) options.
 
Particularly for electric vehicle (EV) charging applications, Samtec's solutions ensure reliable connectivity to support growing EV charging demands and compliance requirements. These encompass Commercial-Off-the-Shelf (COTS) and modified COTS products, combined with Samtec's ongoing Severe Environment Testing (SET) initiative, enabling design flexibility for quick-turn, cost-effective automotive solutions.
 
Samtec's robust and high-power interconnect products provide dependable performance and durability for EV power conversion, thermal management, and both current and future needs. Key applications include on-board chargers, Electric Vehicle Service Equipment (EVSE), AC Level 1 & Level 2 charging, DC fast charging, and V2G smart energy management solutions.
 
Samtec also provides E.L.P.™ (Extended Life Product™) products. These undergo rigorous testing to evaluate contact resistance under simulated storage and field conditions, including 10-year Mixed Flowing Gas (MFG) testing and high mating cycles (250 to 2,500 times), with certain plating and/or contact options available. Furthermore, these interconnect products also pass Severe Environment Testing (SET), a Samtec initiative that subjects products to testing beyond typical industry standards and specifications, many of which stem from general requirements for rugged/harsh environment industries. These products undergo additional testing to ensure they are fully suitable for military, space, automotive, industrial, and other extreme applications.
 
The following sections will categorize automotive applications and introduce Samtec's interconnect system product lines, covering in-vehicle infotainment systems, embedded compute modules, vision systems, C-V2X technology, and charging infrastructure.

Growing demand for bandwidth and connectivity in in-vehicle infotainment

Today, in-vehicle infotainment has become a standard feature. From multimedia touchscreens to driver assistance systems and smartphone pairing, the demand for bandwidth and connectivity is on the rise. Samtec offers rugged, high-speed, and reliable solutions for infotainment applications operating in high-shock and high-vibration environments.
 
Samtec's ultra-low-profile strips feature the ultra-slim, ultra-low-profile Micro Blade & Beam connectors, with stack heights as low as 2 mm. Their slim body designs enable greater PCB space savings and utilize ultra-fine pitches of 0.40 mm and 0.50 mm. The Q2™ Rugged Ground Plane Connector supports performance up to 25 Gbps NRZ (Non-Return-to-Zero). It employs 0.635 mm pitch Edge Rate® contacts with increased insertion depth, integrates a power/ground plane rated up to 15.7 A, and offers optimal shielding and power pin options. The rugged hermaphroditic connectors utilize the Razor Beam™ contact system for high-speed, fine-pitch applications, with pitches of 0.50 mm, 0.635 mm, and 0.80 mm. Their mating/unmating forces are 4-6 times greater than typical micro-pitch connectors. These self-mating connectors help reduce inventory costs and can be interchanged to accommodate different stack heights, with ten options ranging from 5 mm to 12 mm.

Embedded compute modules enhance human-machine interaction reliability

The continuous advancement of autonomous driving technology, coupled with innovations in artificial intelligence and machine learning, is enhancing the reliability of human-machine interaction. Samtec provides high-performance solutions to help capture real-time data, thereby improving vehicle safety and comfort.
 
Samtec's high-density arrays utilize an open-pin-field design for maximum routing and grounding flexibility. The SEARAY™ with a 1.27 mm pitch accommodates up to 560 Edge Rate® contacts, while the SEARAY™ with a 0.80 mm pitch accommodates up to 500 contacts, doubling the density. The LP Array™ low-profile arrays offer stack heights of 4 mm, 4.5 mm, and 5 mm.
 
High-performance array products include the AcceleRate® HP high-performance arrays, supporting data rates up to 112 Gbps PAM4, and the AcceleRate® HD high-density arrays, supporting up to 64 Gbps PAM4. They feature a four-row design supporting up to 400 I/Os, with a roadmap to 1000+ pins (APX6). Low-profile variants offer a 5 mm stack height, extendable up to 16 mm, with a width of 5 mm (ADX6). Data rates are compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE (APX6).
 
The EDGE RATE® Rugged Signal Integrity System features 0.50 mm and 0.80 mm pitch Edge Rate® contacts, optimized for signal integrity and less prone to damage during "zippered" to unmated. The contact wipe distance can reach up to 1.50 mm, ensuring a reliable connection. Stack heights range from 7 mm to 18 mm, and right-angle options are available for increased design flexibility.

Expanding role of automotive vision systems in road and environment perception

From Advanced Driver Assistance Systems (ADAS) to fully autonomous vehicles, the application of automotive vision systems for road and environment perception is becoming increasingly widespread. Samtec offers high-speed, space-saving, and flexible solutions to help connect vision systems to the computing system, enabling swift response to road conditions.
 
The GENERATE® High-Speed Edge Card System uses a 0.80 mm pitch and accommodates up to 200 total Edge Rate® contacts. It supports vertical, right-angle, and edge mounting, employs rugged signal/power combination designs (A-HSEC8-PV) and tucked beam terminal technology (A-HTEC8), and offers latches and weld tabs. Additionally, ultra-low profile strips feature the ultra-slim, ultra-low-profile Micro Blade & Beam connector system. Their slim body design allows stack heights as low as 2 mm and supports ultra-fine pitches of 0.40 mm and 0.50 mm.
 
The High-Speed Signal/Power Arrays utilize power blades rotated 90° to ensure efficient heat dissipation for uniform cooling, increased current capacity, and reduced crowding. The open-pin-field design offers flexibility for grounding and routing, supporting currents up to 15 A per blade (200 VAC/283 VDC).

C-V2X technology leverages 5G networks and cloud services for vehicle intelligence

Cellular Vehicle-to-Everything (C-V2X) technology surpasses line-of-sight systems by utilizing next-generation 5G networks and cloud services to enable vehicle intelligence, improve traffic flow, and enhance safety. Samtec's automotive interconnect portfolio facilitates routing data from radio units to sensors throughout the vehicle.
 
Samtec's precision RF cables and connectors support a frequency range from 18 GHz to 110 GHz. The portfolio includes microwave/millimeter wave cable assemblies, cable connectors, and board connectors. Various solutions support interfaces such as 1.00 mm, 1.35 mm, 1.85 mm, 2.40 mm, 2.92 mm, 3.50 mm, SMP, SMPM, SMA, SSMA, N-Type, and TNCA. The Bulls Eye® high-performance test assemblies operate at frequencies up to 90 GHz.
 
The high-speed array series employs an open-pin-field array design for maximum routing and grounding flexibility. SEARAY™ arrays are available in 1.27 mm and 0.80 mm pitches, accommodating up to 560 Edge Rate® contacts. LP Array™ low-profile arrays offer stack heights of 4 mm, 4.5 mm, and 5 mm. AcceleRate® HP and AcceleRate® HD arrays use a four-row design supporting up to 400 I/Os, with a roadmap for over 1000 pins (APX6).
 
High-speed edge card systems feature pin pitches ranging from 0.50 mm to 2.00 mm, supporting up to 200 total pins. They are available in vertical, right-angle, and edge-mount configurations, offer rugged edge card/power combinations, and include latches and weld tabs.

Charging infrastructure enables fast, efficient on-demand charging solutions

Whether for a single electric vehicle or a large fleet, reliable and accessible charging infrastructure is essential to support long-range mileage with fast, efficient, on-demand charging solutions. Samtec provides rugged, high-power solutions to ensure reliable connectivity, meeting the power conversion, thermal management, and other current and future needs of electric vehicles.
 
The mPOWER® Ultra Micro Power Interconnect utilizes a micro 2.00 mm pitch and supports currents up to 18 A per blade. It enables board-to-board, cable-to-board, panel-to-board, and cable-to-cable connections. Available in 1 to 20 positions with stack heights from 5 mm to 20 mm in vertical and right-angle orientations, it offers selectively loaded contacts to meet creepage and clearance requirements.
 
The flexible stacking product line includes systems with pitches from 0.80 mm to 2.54 mm. They feature pass-through contacts for connecting multiple boards, support up to six rows with a total of 300 pins, and are available in low-profile and skyscraper solutions.
 
The TIGER EYE™ Rugged System employs a high-reliability multi-finger beryllium copper (BeCu) contact system suitable for harsh and high-cycle applications. With a 1.27 mm pitch and surface-mount or through-hole tails, it offers optional ruggedizing features like alignment pins, weld tabs, and screw-downs. It supports vertical and right-angle configurations for parallel, perpendicular, or coplanar applications.
 

Conclusion

Looking at the development trajectory of the automotive industry, electrification, intelligentization, and software-defined vehicles continue to reshape vehicle design philosophies, simultaneously driving the rapid evolution of connector technology. Faced with system demands for high voltage, high speed, and high reliability, connector solutions must strike an optimal balance between electrical performance, mechanical structure, environmental durability, and functional safety, while also supporting modular, platform-based, and cross-generational architectural scalability. The automotive connectors launched by Samtec are closely aligned with trends in vehicle electronic and electrical architectures and are designed and validated from a system-level perspective. They will serve as a key foundation supporting innovation and long-term development in the automotive industry, establishing a solid and reliable connectivity basis for the smart and electric vehicles of the future.