Interconnect solutions for autonomous mobile robots

Molex wire-to-board Nano-Fit Connectors deliver a high-performance compact solution for miniature power applications. Engineered for space efficiency, these connectors ensure superior electrical integrity and reliability through isolated contacts that help prevent contact stubbing. Featuring high-current-carrying capabilities and available in various configurations with multiple plating and color-coding/keying options, these connectors are ideal for precision, space-constrained electronic designs while delivering the highest current compared to similar sized connectors. Nano-Fit Connectors feature a 2.50mm pitch, support currents up to 8.0A, accommodate wire gauges from 26 to 20 AWG, and operate within a temperature range of -40°C to +125°C.
 
With the rapid advancement of electronic miniaturization, consumers increasingly demand greater power density in smaller components. Nano-Fit Connectors utilize a compact design featuring the smallest pitch (2.50mm) within the Fit product family and an 8.0A current rating, handling more power than competing solutions limited to 5.0A. These products incorporate multiple colored and mechanically keyed options, ultra-low mating force terminals and blind-mating interface (BMI) capabilities that help prevent costly connector mating mishaps.
 
Additional design features such as terminal position assurance (TPA) and connector position assurance (CPA) enhance assembly accuracy through secure mating. Nano-Fit Connectors are engineered to deliver versatile solutions that effectively address and help prevent common mating issues while supporting high current in a small package, ensuring reliable electrical performance. With this combination of features, Nano-Fit Connectors are ideally suited for miniature power applications and represent a preferred choice for engineers and designers seeking efficient, high-performance connectivity.
 
Nano-Fit Connectors offer BMI capabilities, multiple mechanical keying and color-coded options, allowing multiple connectors on the same circuit with virtually no cross-mating risk. Color-coding provides visual indication for proper connector mating, accelerating assembly throughput. Additionally, these connectors feature ergonomic latch designs requiring reduced force during unmating. Fully isolated contacts minimize misalignment risk and simplify the mating process. Nano-Fit Connectors incorporate positive-lock housings with anti-snag designs for secure connections. Furthermore, terminal position assurance (TPA), audible click confirmation and wire snags protecting the latch from damage help ensure that mated connector assemblies remain securely engaged.

As consumers demand smaller, faster and more powerful devices, Molex offers another wire-to-board solution: Micro-Fit Connectors deliver a compact, high-performance interconnect solution that balances power and flexibility without compromising space or reliability. These connectors also provide grounding protection and halogen-free components to meet government environmental, health and safety (EH&S) compliance regulation guidelines. Engineered for durability and efficiency, Micro-Fit Connectors offer rich features enabling exceptional design flexibility and significant cost savings. Micro-Fit Connectors feature a 3.00mm pitch, support currents up to 10.5A, accommodate wire gauges from 30 to 18 AWG, and operate within a temperature range of -40°C to +105°C.
 
As thicker PCBs become necessary to support increasing power demands and multiple signals introduce additional complexities, design engineers seek ways to maximize PCB space utilization and overcome spatial constraints in applications. Micro-Fit Connectors offer a compact, high-performance interconnect solution that balances power and flexibility without sacrificing space or reliability. These connectors are engineered for durability and ease of use, featuring reduced mating force terminals capable of withstanding up to 250 mating cycles at lower insertion forces, thereby extending product lifespan and improving assembly operator ergonomics.
 
Micro-Fit Connectors accommodate diverse assembly requirements with surface-mount, press-fit, through-hole and compliant-pin interface (CPI) versions offering exceptional design flexibility. The inclusion of fitting nails and solderable clips provides robust header retention and strain relief for protection against mechanical stresses. Customers can achieve substantial cost savings by eliminating the need for additional manufacturing processes to terminate products to the PCB.
 
The integrated blind-mating interface (BMI) feature accommodates up to 2.54mm of misalignment, facilitating smoother and more forgiving assembly processes. Micro-Fit Connectors offer a compact form factor that delivers significant space savings while enabling high-density circuit connections. Available in multiple circuit sizes and cable lengths, these connectors support power applications and various configurations including board-to-board, wire-to-board and wire-to-wire arrangements. Multiple options, including press-fit and through-hole surface-mount compatible versions, address application requirements and provide design flexibility.

Molex wire-to-board Micro-Lock Plus Connectors feature a compact, low-profile design that delivers reliable performance specifically for space-constrained and demanding applications. This connector family skillfully balances small form factor with mechanical and electrical robustness to overcome numerous challenges. With features ensuring stable connections, environmental protection and assembly simplicity, Micro-Lock Plus Connectors help customers reduce costs, improve efficiency and develop high-performance, durable products. Micro-Lock Plus Connectors are available in 1.25mm, 1.50mm and 2.00mm pitch options, support 2 to 42 circuits, and handle currents up to 4.7A with voltages up to 250V.
 
As equipment across numerous industries becomes increasingly compact and miniaturized, design engineers face growing pressure to maintain reliable electrical connections within limited footprints while ensuring reliability and signal integrity. Micro-Lock Plus Connectors offer a small form factor with high connection reliability, making them ideal for addressing these challenges. Featuring small pitch sizes and low-profile designs, these connectors provide compact solutions that ensure secure mating, durable performance and reliable connections in demanding environments, particularly suitable for space-constrained applications.
 
Beyond space constraints, design engineers require connector solutions that withstand vibration, repeated use and various stresses without connection failures. Micro-Lock Plus Connectors address this challenge through secure mating that helps prevent accidental disconnection, ensuring stable performance and minimizing downtime. The positive-locking feature maintains secure connector mating under common product stresses, preventing intermittent connections and product failures throughout the device lifecycle.
 
Design engineers need diverse connector options to accommodate varying product designs, different electrical requirements and evolving application needs. Limited choices can compromise performance, assembly simplicity or cost efficiency, potentially hindering innovation and delaying time-to-market. The Micro-Lock Plus Connector family offers extensive configuration options, including multiple circuit sizes, current ratings and housing choices, while accommodating various plating options, wiring configurations, TPA, potting capabilities, low-halogen materials, environmental protection and regulatory requirements. With the ability to safely handle high current and voltage levels, Micro-Lock Plus Connectors provide diverse customizable features and incorporate dual-contact terminal designs that satisfy varied design requirements, connection security and reliability needs.

As Autonomous Mobile Robot (AMR) system architectures evolve toward higher power density, modularization and intelligent operation, interconnect solutions have transcended their traditional role as simple electrical conduction components to become fundamental elements ensuring power integrity, signal integrity and system reliability. Consequently, selecting industrial-grade connectors featuring high vibration resistance, excellent EMI shielding design and extended mating cycle durability, while incorporating thermal management, mechanical stress considerations and maintenance accessibility during initial design phases, represents a core strategy for developing highly reliable AMR platforms. The Molex interconnect solutions presented in this article provide smart logistics and industrial automation environments with a more robust and scalable foundation for Autonomous Mobile Robot deployments.