iMX93 EVK by eInfochips

The EIC- i.MX93-210 is an RDP based on the i.MX93 application processors. The processor features a scalable Arm Ethos™-U65 microNPU Core for efficient machine learning acceleration, as well as advanced security with an integrated EdgeLock secure enclave to support edge computing. The RDP enables developers to begin creating high-performance, cost-effective, and energy-efficient machine-learning applications. Wi-Fi, Bluetooth, Gigabit Ethernet, CAN, and 3G/4G/LTE connectivity via a Mezzanine Card are all available. The kit includes pre-integrated Linux, making it an excellent choice for applications such as industrial automation, smart home & intelligent appliances, smart buildings, and automotive.

Specification

CPU Name - NXP i.MX93
 
CPU Type - Two Cortex®-A55 processors operating up to 1.7 GHz.

Memory

LPDDR4 : 1x 2GB LPDDR4x RAM
 
eMMC : 1x 16GB eMMC 5.1
 
SDIO : 1x SDIO 3.0 interface (mux with WLAN)
 
Micro-SD card : 1x SD Card 3.0 interface

Connectivity 

Wi-Fi
 
• AWCM276NF – IEEE 802.11 a/b/g/n/ac, 2.4/5.0 GHz
• 2x MHF4 antenna connector
• Matter 1.0 Ready
 
Bluetooth - Bluetooth 5.3 compliant with Bluetooth 2.1 + Enhanced Data Rate (EDR)
 
USB - 1x USB2.0 with DRP / 1x USB2.0 Host mode Only
 
Ethernet - 1x RGMI Interface

Display

DSI - 1x 4-Lane MIPI DSI v1.2 interface
 
LVDS - 1x 4-Lane LVDS
 
HDMI - 1x HDMI interface (Mux)

Camera

CSI - 2 Lane MIPI CSI-2 v1.2 interface
 
RGB - 8-bit RGB interface (Mux)

Audio

CSI -  3x SAI / 1x PDM

Sensors

Sensors - 1x 4 channel current sensor

Other

• 1x CAN Interface
• 3x UART, 4x I2C, 2x SPI, 4x ADC,GPIOs
• 1x Reset Switch, 1x ON/OFF Switch

Power specifications

SOM - SOM: 3.8V to 5.5V (Typ. 5V)
 
Carrier (Kit) - 10.8V to 13.2V (Typ. 12V)

Mechanical specifications 

SOM - 65mm x 55mm
 
Carrier (Kit) - 85mm x 100mm
 
OS SUPPORT
 
OS - Linux