| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Obsolete |
| Automotive | No |
| PPAP | No |
| Logic Family | LVC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 8 |
| Number of Channels per Chip | 32 |
| Number of Inputs per Chip | 32 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 32 |
| Number of Output Enables per Chip | 8 Low |
| Bus Hold | Yes |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 2.7(Typ)@3.3V|3.3(Typ)@2.7V |
| Absolute Propagation Delay Time (ns) | 17.7 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 12 |
| Maximum High Level Output Current (mA) | -12 |
| Minimum Operating Supply Voltage (V) | 1.2 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Tolerant I/Os (V) | 5 |
| Typical Quiescent Current (uA) | 0.1 |
| Maximum Quiescent Current (uA) | 40 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 1.2(Max) |
| Package Width | 5.6(Max) |
| Package Length | 13.6(Max) |
| PCB changed | 96 |
| Standard Package Name | BGA |
| Supplier Package | LFBGA |
| Pin Count | 96 |
| Lead Shape | Ball |
