RoHS (Unione Europea) | Not Compliant |
ECCN (Stati Uniti) | 3A991.d. |
Stato del componente | Active |
Codice HTS | 8542.31.00.60 |
Automotive | No |
PPAP | No |
Family Name | Axcelerator |
User I/Os | 586 |
Process Technology | 0.15um |
Number of I/O Banks | 8 |
Number of Inter Dielectric Layers | 7 |
Number of Registers | 21504 |
Operating Supply Voltage (V) | 1.5 |
Logic Elements | 21504 |
Device System Gates | 2000000 |
Program Memory Type | OTP |
Embedded Memory (Kbit) | 288 |
Total Number of Block RAM | 64 |
Device Logic Gates | 1060000 |
Device Logic Units | 21504 |
Number of Global Clocks | 8 |
Device Number of DLLs/PLLs | 8 |
Programmability | Yes |
Reprogrammability Support | No |
Copy Protection | No |
In-System Programmability | No |
Opr. Frequency (MHz) | 763 |
Speed Grade | 1 |
Maximum Propagation Delay Time (ns) | 0.85 |
Maximum I/O Performance | 700Mbps |
Minimum Operating Supply Voltage (V) | 1.425 |
Maximum Operating Supply Voltage (V) | 1.575 |
I/O Voltage (V) | 1.5|1.8|2.5|3.3 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 |
Supplier Temperature Grade | Commercial |
Packaging | Tray |
Tradename | Axcelerator |
Mounting | Surface Mount |
Package Height | 1.73 |
Package Width | 31 |
Package Length | 31 |
PCB changed | 896 |
Standard Package Name | BGA |
Supplier Package | FBGA |
Pin Count | 896 |
Lead Shape | Ball |