RoHS (Unione Europea) | Not Compliant |
ECCN (Stati Uniti) | EAR99 |
Stato del componente | Active |
Codice HTS | 8542.39.00.60 |
SVHC | Yes |
Tasso di SVHC superiore ai limiti consentiti | Yes |
Automotive | No |
PPAP | No |
Type | D-Type |
Logic Family | ACT |
Latch Mode | Transparent |
Number of Channels per Chip | 8 |
Number of Elements per Chip | 1 |
Number of Inputs per Chip | 8 |
Number of Input Enables per Element | 1 |
Number of Selection Inputs per Element | 0 |
Number of Outputs per Chip | 8 |
Number of Output Enables per Element | 1 |
Bus Hold | No |
Set/Reset | No |
Polarity | Non-Inverting |
Maximum Propagation Delay Time @ Maximum CL (ns) | 10.4@5V |
Absolute Propagation Delay Time (ns) | 13.5 |
Process Technology | CMOS |
Output Type | 3-State |
Maximum Low Level Output Current (mA) | 24 |
Maximum High Level Output Current (mA) | -24 |
Minimum Operating Supply Voltage (V) | 4.5 |
Typical Operating Supply Voltage (V) | 5 |
Maximum Operating Supply Voltage (V) | 5.5 |
Maximum Quiescent Current (uA) | 8 |
Propagation Delay Test Condition (pF) | 50 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 125 |
Supplier Temperature Grade | Military |
Packaging | Tube |
Mounting | Through Hole |
Package Height | 3.56(Max) |
Package Width | 7.62(Max) |
Package Length | 26.92(Max) |
PCB changed | 20 |
Standard Package Name | DIP |
Supplier Package | CDIP |
Pin Count | 20 |
Lead Shape | Through Hole |