| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Codice HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Logic Family | AC |
| Logic Function | NAND |
| Number of Elements per Chip | 4 |
| Number of Element Inputs | 2-IN |
| Number of Output Enables per Element | 0 |
| Number of Selection Inputs per Element | 0 |
| Number of Element Outputs | 1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 10.2@3.3V|7.3@5V|91@1.5V |
| Absolute Propagation Delay Time (ns) | 91 |
| Process Technology | CMOS |
| Output Type | Push-Pull |
| Maximum Low Level Output Current (mA) | 24 |
| Maximum High Level Output Current (mA) | -24 |
| Minimum Operating Supply Voltage (V) | 1.5 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Maximum Quiescent Current (uA) | 4 |
| Propagation Delay Test Condition (pF) | 50 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Military |
| Packaging | Tube |
| Mounting | Through Hole |
| Package Height | 5.08(Max) - 0.51(Min) |
| Package Width | 6.6(Max) |
| Package Length | 19.69(Max) |
| PCB changed | 14 |
| Standard Package Name | DIP |
| Supplier Package | PDIP |
| Pin Count | 14 |
| Lead Shape | Through Hole |
