| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | 3A991.b.2.b |
| Stato del componente | Active |
| Codice HTS | 8542.32.00.41 |
| Automotive | No |
| PPAP | No |
| Chip Density (bit) | 8M |
| Number of Words | 512K |
| Number of Bits/Word (bit) | 16 |
| Data Rate Architecture | SDR |
| Timing Type | Asynchronous |
| Max. Access Time (ns) | 10 |
| Process Technology | 65nm |
| Minimum Operating Supply Voltage (V) | 2.2 |
| Typical Operating Supply Voltage (V) | 2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 0.81(Max) |
| Package Width | 6 |
| Package Length | 8 |
| PCB changed | 48 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| Pin Count | 48 |
| Lead Shape | Ball |
