| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | 5A992.c |
| Stato del componente | Active |
| Codice HTS | 8542.31.00.25 |
| Automotive | Yes |
| PPAP | Unknown |
| Family Name | T2G |
| Instruction Set Architecture | RISC |
| Device Core | ARM Cortex M0+|ARM Cortex M7 |
| Core Architecture | ARM |
| Maximum CPU Frequency (MHz) | 100|240 |
| Maximum Clock Rate (MHz) | 100|240 |
| Data Bus Width (bit) | 32 |
| Program Memory Type | Flash |
| Program Memory Size | 4160KB |
| RAM Size | 384KB |
| Programmability | Yes |
| Interface Type | CAN/Ethernet/I2C/LIN/SPI/UART |
| Number of I/Os | 135 |
| No. of Timers | 2 |
| Number of ADCs | 1 |
| ADC Channels | 48 |
| ADC Resolution (bit) | 12 |
| Number of DACs | 1 |
| DAC Channels | 1 |
| USART | 0 |
| UART | 12 |
| USB | 0 |
| SPI | 12 |
| I2C | 12 |
| I2S | 0 |
| CAN | 4 |
| Ethernet | 1 |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3|5 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Maximum Power Dissipation (mW) | 2500 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 105 |
| Packaging | Tray |
| Mounting | Surface Mount |
| PCB changed | 272 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| Pin Count | 272 |
| Lead Shape | Ball |
