| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Codice HTS | 8542.31.00.55 |
| Automotive | No |
| PPAP | No |
| Family Name | MAX® II |
| Logic Elements | 570 |
| Program Memory Type | Flash |
| Memory Size (Kbit) | 8 |
| Number of Logic Blocks/Elements | 57 |
| Number of Global Clocks | 4 |
| Number of I/O Banks | 2 |
| Number of Macro Cells | 440 |
| Process Technology | 0.18um |
| Data Gate | No |
| Maximum Number of User I/Os | 160 |
| In-System Programmability | Yes |
| Number of Inter Dielectric Layers | 6 |
| Programmability | Yes |
| Reprogrammability Support | No |
| Maximum Internal Frequency (MHz) | 1474.9 |
| Maximum Clock to Output Delay (ns) | 8.6 |
| Maximum Propagation Delay Time (ns) | 14 |
| Speed Grade | 8 |
| Individual Output Enable Control | Yes |
| Minimum Operating Supply Voltage (V) | 1.71 |
| Maximum Operating Supply Voltage (V) | 1.89 |
| Typical Operating Supply Voltage (V) | 1.8 |
| I/O Voltage (V) | 1.5|1.8|2.5|3.3 |
| Tolerant Configuration Interface Voltage (V) | 1.8|2.5|3.3|5 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 100 |
| Supplier Temperature Grade | Industrial |
| Packaging | Tray |
| Tradename | MAX |
| Mounting | Surface Mount |
| Package Height | 0.85 |
| Package Width | 11 |
| Package Length | 11 |
| PCB changed | 256 |
| Standard Package Name | BGA |
| Supplier Package | Micro FBGA |
| Pin Count | 256 |
| Lead Shape | Ball |
