RoHS (Unione Europea) | Compliant |
ECCN (Stati Uniti) | EAR99 |
Stato del componente | NRND |
Codice HTS | 8542.32.00.28 |
Automotive | No |
PPAP | No |
DRAM Type | DDR2 SDRAM |
Chip Density (bit) | 512M |
Organization | 64Mx8 |
Number of Internal Banks | 4 |
Number of Words per Bank | 16M |
Number of Bits/Word (bit) | 8 |
Data Bus Width (bit) | 8 |
Maximum Clock Rate (MHz) | 333 |
Maximum Access Time (ns) | 0.45 |
Address Bus Width (bit) | 16 |
Interface Type | SSTL_18 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Maximum Operating Supply Voltage (V) | 1.9 |
Operating Current (mA) | 250 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Number of I/O Lines (bit) | 8 |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 1(Max) |
Package Width | 8 |
Package Length | 10.5 |
PCB changed | 60 |
Standard Package Name | BGA |
Supplier Package | TW-BGA |
Pin Count | 60 |