| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | 3A991b.2.a. |
| Stato del componente | Obsolete |
| Codice HTS | 8542.32.00.41 |
| Automotive | No |
| PPAP | No |
| Chip Density (bit) | 36M |
| Number of Words | 2M |
| Number of Bits/Word (bit) | 18 |
| Architecture | Pipelined |
| Data Rate Architecture | DDR |
| Address Bus Width (bit) | 21 |
| Number of Ports | 1 |
| Timing Type | Synchronous |
| Max. Access Time (ns) | 0.35 |
| Maximum Clock Rate (MHz) | 250 |
| Process Technology | CMOS |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.9 |
| Operating Current (mA) | 550 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Temperature Grade | Commercial |
| Mounting | Surface Mount |
| Package Height | 1.24(Max) |
| Package Width | 15 |
| Package Length | 17 |
| PCB changed | 165 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 165 |
| Lead Shape | Ball |
