| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Codice HTS | 8542.39.00.60 |
| Automotive | Yes |
| PPAP | Yes |
| Type | General Purpose |
| Process Technology | CMOS|TTL |
| Number of Channels per Chip | 1 |
| Maximum Data Rate | 25Mbps |
| Maximum Rise Time (ns) | 3.2(Typ) |
| Maximum Fall Time (ns) | 2.7(Typ) |
| Maximum Pulse Width Distortion (ns) | 35 |
| Output Type | CMOS |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 3 |
| Maximum Propagation Delay Time (tPHL) (ns) | 67 |
| Minimum Isolation Voltage (Vrms) | 3000 |
| Maximum Propagation Delay Time (tPLH) (ns) | 67 |
| Maximum Working Insulation Voltage | 400Vrms |
| Maximum Power Dissipation (mW) | 34 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tube |
| Minimum Common Mode Rejection (kV/us) | 25 |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 3.98(Max) |
| Package Length | 5(Max) |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC |
| Pin Count | 8 |
| Lead Shape | Gull-wing |
