| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Codice HTS | 8542.33.00.01 |
| Automotive | No |
| PPAP | No |
| Type | High Speed Amplifier |
| Manufacturer Type | High Speed Amplifier |
| Number of Channels per Chip | 4 |
| Process Technology | BiCOM |
| Maximum Input Offset Voltage (mV) | 0.6@±5V |
| Minimum Dual Supply Voltage (V) | ±2.5 |
| Typical Dual Supply Voltage (V) | ±12|±15|±3|±5|±9 |
| Maximum Dual Supply Voltage (V) | ±18 |
| Maximum Input Offset Current (uA) | 0.12@±15V |
| Maximum Input Bias Current (uA) | 0.5@±15V |
| Maximum Supply Current (mA) | 9.6@±5V |
| Typical Output Current (mA) | 25@±5V |
| Power Supply Type | Dual |
| Typical Slew Rate (V/us) | 220@±5V |
| Typical Input Noise Voltage Density (nV/rtHz) | 8@±15V |
| Typical Voltage Gain (dB) | 93.06 |
| Typical Noninverting Input Current Noise Density (pA/rtHz) | 0.8@±15V |
| Minimum PSRR (dB) | 92 |
| Minimum CMRR (dB) | 78 |
| Minimum CMRR Range (dB) | 75 to 80 |
| Typical Gain Bandwidth Product (MHz) | 22 |
| Typical Settling Time (ns) | 380 |
| Shut Down Support | No |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 3.99(Max) |
| Package Length | 10.01(Max) |
| PCB changed | 16 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 16 |
| Lead Shape | Gull-wing |
