Micron TechnologyMT29TZZZ8D5JKEZB-107 W.95EMulti-Chip Package Memory
8GB MLC e.MMC and 8Gb Mobile LPDDR3 in 221-Ball MCP
| Compliant | |
| Unconfirmed | |
| 8542.32.00.71 | |
| Mounting | Surface Mount |
| PCB changed | 221 |
| Standard Package Name | BGA |
| Supplier Package | WFBGA |
| 221 |
| EDA / CAD Models |