RoHS (Unione Europea) | Compliant |
ECCN (Stati Uniti) | EAR99 |
Stato del componente | Active |
Codice HTS | 8542.32.00.02 |
SVHC | Yes |
Automotive | No |
PPAP | No |
DRAM Type | SDRAM |
Chip Density (bit) | 64M |
Organization | 2Mx32 |
Number of Internal Banks | 4 |
Number of Words per Bank | 512K |
Number of Bits/Word (bit) | 32 |
Data Bus Width (bit) | 32 |
Maximum Clock Rate (MHz) | 167 |
Maximum Access Time (ns) | 17|5.4|7.5 |
Address Bus Width (bit) | 13 |
Process Technology | CMOS |
Interface Type | LVTTL |
Minimum Operating Supply Voltage (V) | 3 |
Typical Operating Supply Voltage (V) | 3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Operating Current (mA) | 120 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Number of I/O Lines (bit) | 32 |
Mounting | Surface Mount |
Package Height | 0.65 |
Package Width | 8 |
Package Length | 13 |
PCB changed | 90 |
Standard Package Name | BGA |
Supplier Package | VFBGA |
Pin Count | 90 |
Lead Shape | Ball |