| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Codice HTS | 8542.32.00.71 |
| Automotive | No |
| PPAP | No |
| Cell Type | NOR |
| Chip Density (bit) | 256M |
| Architecture | Sectored |
| Boot Block | Yes |
| Block Organization | Symmetrical |
| Location of Boot Block | Bottom|Top |
| Address Width (bit) | 24 |
| Sector Size | 128Kbyte x 256 |
| Page Size | 8Words/16byte |
| Number of Bits/Word (bit) | 8/16 |
| Number of Words | 32M/16M |
| Programmability | Yes |
| Timing Type | Asynchronous |
| Max. Access Time (ns) | 90 |
| Maximum Erase Time (s) | 300/Chip |
| Maximum Page Access Time (ns) | 30 |
| Maximum Programming Time (ms) | 350000/Chip |
| OE Access Time (ns) | 25 |
| Interface Type | Parallel |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Programming Voltage (V) | 2.7 to 3.6 |
| Operating Current (mA) | 100 |
| Page Read Current (mA) | 20 |
| Program Current (mA) | 30 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Command Compatible | Yes |
| ECC Support | No |
| Support of Page Mode | Yes |
| Mounting | Surface Mount |
| Package Height | 0.65(Min) |
| Package Width | 11 |
| Package Length | 13 |
| PCB changed | 64 |
| Standard Package Name | BGA |
| Supplier Package | LFBGA |
| Pin Count | 64 |
| Lead Shape | Ball |
