| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Unconfirmed |
| Codice HTS | 8542.32.00.36 |
| Automotive | Unknown |
| PPAP | Unknown |
| DRAM Type | Mobile LPDDR4 SDRAM |
| Chip Density (bit) | 4G |
| Organization | 128Mx32 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 16M |
| Number of Bits/Word (bit) | 32 |
| Data Bus Width (bit) | 32 |
| Maximum Clock Rate (MHz) | 3200 |
| Maximum Access Time (ns) | 3.6 |
| Address Bus Width (bit) | 17 |
| Interface Type | LVSTL |
| Minimum Operating Supply Voltage (V) | 1.06|1.7 |
| Typical Operating Supply Voltage (V) | 1.1|1.8 |
| Maximum Operating Supply Voltage (V) | 1.17|1.95 |
| Minimum Operating Temperature (°C) | -30 |
| Maximum Operating Temperature (°C) | 105 |
| Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 32 |
| Mounting | Surface Mount |
| Package Height | 0.48(Max) |
| Package Width | 10 |
| Package Length | 15 |
| PCB changed | 200 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 200 |
