RoHS (Unione Europea) | Compliant |
ECCN (Stati Uniti) | 3A991b.1.a. |
Stato del componente | Active |
Codice HTS | 8542.32.00.02 |
Cell Type | NOR |
Chip Density (bit) | 2G |
Architecture | Sectored |
Boot Block | Yes |
Block Organization | Symmetrical |
Location of Boot Block | Bottom|Top |
Address Width (bit) | 32 |
Sector Size | 256Kbyte x 1024 |
Page Size | 256byte/512byte |
Number of Bits/Word (bit) | 1/2/4 |
Number of Words | 2G/1G/512M |
Programmability | Yes |
Timing Type | Synchronous |
Max. Access Time (ns) | 8 |
Maximum Erase Time (s) | 2762/Bulk |
Maximum Programming Time (ms) | 1.7/Page |
Process Technology | 45nm, MirrorBit |
Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
Maximum Operating Frequency (MHz) | 133 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Maximum Operating Supply Voltage (V) | 2 |
Programming Voltage (V) | 1.7 to 2 |
Operating Current (mA) | 130 |
Program Current (mA) | 66 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 105 |
Supplier Temperature Grade | Industrial Plus |
Command Compatible | Yes |
ECC Support | Yes |
Support of Page Mode | No |
Packaging | Tray |
Mounting | Surface Mount |
Package Height | 1.2(Max) - 0.2(Min) |
Package Width | 8 |
Package Length | 8 |
PCB changed | 24 |
Standard Package Name | BGA |
Supplier Package | BGA |
Pin Count | 24 |