| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Codice HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | General Purpose |
| Process Technology | CMOS |
| Number of Channels per Chip | 3 |
| Maximum Data Rate | 150Mbps |
| Maximum Rise Time (ns) | 4 |
| Maximum Fall Time (ns) | 4 |
| Minimum Pulse Width (ns) | 5 |
| Maximum Pulse Width Distortion (ns) | 4.5 |
| Maximum Propagation Delay Skew (ns) | 4.5 |
| Output Type | CMOS |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 2.5 |
| Maximum Propagation Delay Time (tPHL) (ns) | 13 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 13 |
| Maximum Working Insulation Voltage | 630Vp |
| Maximum Output Current Drive (mA) | 10 |
| Maximum Power Dissipation (mW) | 275 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Typical Operating Supply Voltage (V) | 3.3|5 |
| Forward/Reverse Channels | 2/1 |
| Minimum Common Mode Rejection (kV/us) | 35 |
| Supplier Temperature Grade | Industrial |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 1.25(Min) |
| Package Width | 3.9 |
| Package Length | 9.9 |
| PCB changed | 16 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 16 |
