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Silicon Motion TechnologySM662PED-BDS | 153-b eMMC 5.1 TLC NAND 128GB i-tempFlash
Ferri-eMMC BGA 153-b eMMC 5.1 TLC NAND i-temp 128GB
| Compliant | |
| EAR99 | |
| Unconfirmed | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Unknown |
| Mounting | Surface Mount |
| Package Height | 1.4 mm |
| Package Width | 14 mm |
| Package Length | 18 mm |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| 153 | |
| Lead Shape | Ball |
| EDA / CAD Models |