| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Codice HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Logic Family | AUP |
| Logic Function | OR |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 2-IN |
| Number of Output Enables per Element | 0 |
| Number of Selection Inputs per Element | 0 |
| Number of Element Outputs | 1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 20.9@1.2V|14.2@1.5V|11@1.8V|7.6@2.5V|6.2@3.3V |
| Absolute Propagation Delay Time (ns) | 25.5 |
| Process Technology | CMOS |
| Output Type | Push-Pull |
| Maximum Low Level Output Current (mA) | 4 |
| Maximum High Level Output Current (mA) | -4 |
| Minimum Operating Supply Voltage (V) | 0.8 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Maximum Quiescent Current (uA) | 0.5 |
| Propagation Delay Test Condition (pF) | 30 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.33(Max) |
| Package Width | 0.8 |
| Package Length | 1.6 |
| PCB changed | 8 |
| Standard Package Name | BGA |
| Supplier Package | DSBGA |
| Pin Count | 8 |
| Lead Shape | Ball |
