RoHS (Unione Europea) | Compliant |
ECCN (Stati Uniti) | EAR99 |
Stato del componente | Obsolete |
Codice HTS | 8542330001 |
SVHC | Yes |
Automotive | No |
PPAP | No |
Logic Family | LVT |
Logic Function | Bus Transceiver |
Data Flow Direction | Bi-Directional |
Number of Elements per Chip | 4 |
Number of Channels per Chip | 32 |
Number of Selection Inputs per Element | 0 |
Number of Output Enables per Element | 1 Low |
Number of Input Enables per Element | 0 |
Number of Direction Control Inputs | 1 Low/High |
Bus Hold | Yes |
Polarity | Non-Inverting |
Absolute Propagation Delay Time (ns) | 5.5 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 3.3@3.3V|3.7@2.7V |
Propagation Delay Test Condition (pF) | 50 |
Process Technology | BiCMOS |
Input Level | LVTTL |
Output Level | LVTTL |
Output Type | 3-State |
Maximum Low Level Output Current (mA) | 64 |
Maximum High Level Output Current (mA) | -32 |
Maximum Quiescent Current (uA) | 10000 |
Minimum Operating Supply Voltage (V) | 2.7 |
Maximum Operating Supply Voltage (V) | 3.6 |
Tolerant I/Os (V) | 5 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Commercial |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 0.95(Max) |
Package Width | 5.6(Max) |
Package Length | 13.6(Max) |
PCB changed | 96 |
Standard Package Name | BGA |
Supplier Package | BGA MICROSTAR |
Pin Count | 96 |
Lead Shape | Ball |