RoHS (Unione Europea) | Compliant |
ECCN (Stati Uniti) | EAR99 |
Stato del componente | Active |
Codice HTS | 8542.39.00.60 |
Automotive | No |
PPAP | No |
Logic Family | SSTEB |
Logic Function | Registered Buffer |
Number of Channels per Chip | 25 |
Number of Elements per Chip | 1 |
Number of Element Inputs | 25 |
Number of Input Enables per Element | 0 |
Number of Selection Inputs per Element | 2 |
Number of Element Outputs | 25 |
Number of Output Enables per Element | 0 |
Bus Hold | No |
Polarity | Non-Inverting |
Triggering Type | Positive-Edge/Negative-Edge |
Maximum Frequency (MHz) | 410(Min) |
Maximum Propagation Delay Time @ Maximum CL (ns) | 1.5@1.8V|1.7@1.5V |
Absolute Propagation Delay Time (ns) | 3 |
Process Technology | CMOS |
Reset Type | Asynchronous |
Input Signal Type | Single-Ended |
Output Signal Type | Single-Ended |
Maximum Low Level Output Current (mA) | 8 |
Maximum High Level Output Current (mA) | -8 |
Minimum Operating Supply Voltage (V) | 1.425 |
Typical Operating Supply Voltage (V) | 1.5|1.8 |
Maximum Operating Supply Voltage (V) | 1.9 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Commercial |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 0.91(Max) |
Package Width | 5.6(Max) |
Package Length | 13.6(Max) |
PCB changed | 96 |
Standard Package Name | BGA |
Supplier Package | BGA |
Pin Count | 96 |
Lead Shape | Ball |