| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Automotive | No |
| PPAP | No |
| Logic Family | HCT |
| Logic Function | Buffer |
| Number of Elements per Chip | 6 |
| Number of Channels per Chip | 6 |
| Number of Inputs per Chip | 6 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 6 |
| Number of Output Enables per Chip | 0 |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 21@5.5V|23@4.5V |
| Absolute Propagation Delay Time (ns) | 28 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Maximum Low Level Output Current (mA) | 4 |
| Maximum High Level Output Current (mA) | -4 |
| Minimum Operating Supply Voltage (V) | 4.5 |
| Typical Operating Supply Voltage (V) | 5 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Maximum Quiescent Current (uA) | 1 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Packaging | Magazine |
| Mounting | Through Hole |
| Package Height | 3.5 |
| Package Width | 6.4 |
| Package Length | 19.75(Max) |
| PCB changed | 14 |
| Standard Package Name | DIP |
| Supplier Package | PDIP |
| Pin Count | 14 |
| Lead Shape | Through Hole |
