RoHS (Unione Europea) | Compliant |
ECCN (Stati Uniti) | EAR99 |
Stato del componente | Obsolete |
Codice HTS | 8542.32.00.36 |
Automotive | No |
PPAP | No |
DRAM Type | DDR3L SDRAM |
Chip Density (bit) | 2G |
Organization | 128Mx16 |
Number of Internal Banks | 8 |
Number of Words per Bank | 16M |
Number of Bits/Word (bit) | 16 |
Data Bus Width (bit) | 16 |
Maximum Clock Rate (MHz) | 933 |
Maximum Access Time (ns) | 0.195 |
Address Bus Width (bit) | 17 |
Minimum Operating Supply Voltage (V) | 1.283 |
Typical Operating Supply Voltage (V) | 1.35 |
Maximum Operating Supply Voltage (V) | 1.45 |
Operating Current (mA) | 235 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 95 |
Supplier Temperature Grade | Commercial |
Number of I/O Lines (bit) | 16 |
Mounting | Surface Mount |
Package Height | 0.6(Max) mm |
Package Width | 7.5 mm |
Package Length | 13 mm |
PCB changed | 96 |
Standard Package Name | BGA |
Supplier Package | VFBGA |
Pin Count | 96 |
Lead Shape | Ball |