EU RoHS | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.39.00.60 |
Automotive | Unknown |
PPAP | Unknown |
Logic Family | AUP |
Logic Function | Buffer |
Number of Elements per Chip | 2 |
Number of Channels per Chip | 2 |
Number of Inputs per Chip | 2 |
Number of Input Enables per Chip | 0 |
Number of Outputs per Chip | 2 |
Number of Output Enables per Chip | 0 |
Bus Hold | No |
Polarity | Non-Inverting |
Maximum Propagation Delay Time @ Maximum CL (ns) | 10.3@1.4V to 1.6V|16.3@1.1V to 1.3V|5.6@3V to 3.6V|6.4@2.3V to 2.7V|8.1@1.65V to 1.95V |
Absolute Propagation Delay Time (ns) | 20.8 |
Process Technology | CMOS |
Input Signal Type | Single-Ended |
Maximum Low Level Output Current (mA) | 4 |
Maximum High Level Output Current (mA) | -4 |
Minimum Operating Supply Voltage (V) | 0.8 |
Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Maximum Quiescent Current (uA) | 0.5 |
Propagation Delay Test Condition (pF) | 30 |
Maximum Power Dissipation (mW) | 250 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Mounting | Surface Mount |
Package Height | 0.3 |
Package Width | 0.8 |
Package Length | 1 |
PCB changed | 6 |
Standard Package Name | SON |
Supplier Package | X2SON |
Pin Count | 6 |