EU RoHS | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.39.00.60 |
Automotive | No |
PPAP | No |
Logic Family | HC |
Logic Function | NAND |
Number of Elements per Chip | 4 |
Number of Element Inputs | 2-IN |
Number of Output Enables per Element | 0 |
Number of Selection Inputs per Element | 0 |
Number of Element Outputs | 1 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 13@6V|15@4.5V|75@2V |
Absolute Propagation Delay Time (ns) | 135 |
Process Technology | CMOS |
Maximum Low Level Output Current (mA) | 5.2 |
Maximum High Level Output Current (mA) | -5.2 |
Minimum Operating Supply Voltage (V) | 2 |
Typical Operating Supply Voltage (V) | 5 |
Maximum Operating Supply Voltage (V) | 6 |
Maximum Quiescent Current (uA) | 1 |
Propagation Delay Test Condition (pF) | 50 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 1.38 |
Package Width | 3.9 |
Package Length | 8.95(Max) |
PCB changed | 14 |
Standard Package Name | SO |
Supplier Package | SOIC |
Pin Count | 14 |
Lead Shape | Gull-wing |