EU RoHS | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.32.00.28 |
Automotive | No |
PPAP | No |
DRAM Type | DDR SDRAM |
Chip Density (bit) | 512M |
Organization | 32Mx16 |
Number of Internal Banks | 4 |
Number of Words per Bank | 8M |
Number of Bits/Word (bit) | 16 |
Data Bus Width (bit) | 16 |
Maximum Clock Rate (MHz) | 166 |
Maximum Access Time (ns) | 0.7 |
Address Bus Width (bit) | 15 |
Process Technology | CMOS |
Interface Type | SSTL_2 |
Minimum Operating Supply Voltage (V) | 2.3 |
Typical Operating Supply Voltage (V) | 2.5 |
Maximum Operating Supply Voltage (V) | 2.7 |
Operating Current (mA) | 140 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Number of I/O Lines (bit) | 16 |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 1(Max) |
Package Width | 8 |
Package Length | 13 |
PCB changed | 60 |
Standard Package Name | BGA |
Supplier Package | TW-BGA |
Pin Count | 60 |