Micron TechnologyMT29AZ5A5CHGSQ-18IT.87UMulti-Chip Package Memory
NAND Flash with DRAM MCP
| Active | |
| EA | |
| Mounting | Surface Mount |
| Package Height | 0.59 |
| Package Width | 9.5 |
| Package Length | 10.5 |
| PCB changed | 162 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 162 |
| EDA / CAD Models |