| EU RoHS | Compliant |
| ECCN (US) | 3A991b.1.a. |
| Part Status | Active |
| HTS | 8542.32.00.71 |
| Automotive | No |
| PPAP | No |
| Cell Type | NOR |
| Chip Density (bit) | 32M |
| Architecture | Sectored |
| Boot Block | Yes |
| Block Organization | Symmetrical |
| Location of Boot Block | Bottom|Top |
| Address Width (bit) | 32 |
| Sector Size | 4Kbyte x 1024 |
| Page Size | 256byte |
| Number of Bits/Word (bit) | 1/2/4 |
| Number of Words | 32M/16M/8M |
| Programmability | Yes |
| Timing Type | Synchronous |
| Maximum Erase Time (s) | 0.05/Chip |
| Maximum Programming Time (ms) | 1.5/Page |
| Process Technology | CMOS |
| Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
| Minimum Operating Supply Voltage (V) | 2.3 |
| Typical Operating Supply Voltage (V) | 3|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Programming Voltage (V) | 2.7 to 3.6 |
| Operating Current (mA) | 20 |
| Program Current (mA) | 25 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Command Compatible | No |
| ECC Support | No |
| Support of Page Mode | No |
| Minimum Endurance (Cycles) | 100000 |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 0.78 |
| Package Width | 6 |
| Package Length | 8 |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | TBGA |
| Pin Count | 24 |
| Lead Shape | Ball |
