| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.31.00.60 |
| Automotive | No |
| PPAP | No |
| Family Name | MAX 10 |
| User I/Os | 27 |
| Process Technology | 55nm |
| Shift Registers | Utilize Memory |
| Operating Supply Voltage (V) | 1.2 |
| Logic Elements | 2000 |
| Number of Multipliers | 16 (18x18) |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 108 |
| Device Logic Units | 2000 |
| Number of Global Clocks | 20 |
| Device Number of DLLs/PLLs | 2 |
| Dedicated DSP | 16 |
| Programmability | Yes |
| Reprogrammability Support | Yes |
| Copy Protection | No |
| In-System Programmability | Yes |
| Speed Grade | 8 |
| Differential I/O Standards | HSUL|LVDS|SSTL |
| External Memory Interface | DDR2 SDRAM|DDR3 SDRAM|DDR3L SDRAM|LPDDR2 SDRAM |
| Minimum Operating Supply Voltage (V) | 1.15 |
| Maximum Operating Supply Voltage (V) | 1.25 |
| I/O Voltage (V) | 1.2|1.35|1.5|1.8|2.5|3|3.3 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Mounting | Surface Mount |
| Package Height | 0.33 |
| Package Width | 3.4 |
| Package Length | 3.47 |
| PCB changed | 36 |
| Standard Package Name | BGA |
| Supplier Package | VBGA |
| Pin Count | 36 |
| Lead Shape | Ball |
