| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Logic Family | AUP |
| Logic Function | Buffer |
| Number of Elements per Chip | 3 |
| Number of Channels per Chip | 3 |
| Number of Inputs per Chip | 3 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 3 |
| Number of Output Enables per Chip | 0 |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 16.3@1.2V|10.3@1.5V|8.1@1.8V|6.4@2.5V|5.6@3.3V |
| Absolute Propagation Delay Time (ns) | 20.8 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Maximum Low Level Output Current (mA) | 4 |
| Maximum High Level Output Current (mA) | -4 |
| Minimum Operating Supply Voltage (V) | 0.8 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Tolerant I/Os (V) | 3.6 |
| Maximum Quiescent Current (uA) | 0.5 |
| Propagation Delay Test Condition (pF) | 30 |
| Maximum Power Dissipation (mW) | 250 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.31(Max) mm |
| Package Width | 0.8 mm |
| Package Length | 1.35 mm |
| PCB changed | 8 |
| Standard Package Name | SON |
| Supplier Package | X2SON |
| Pin Count | 8 |
