| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Obsolete |
| Código HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Logic Family | AVC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 4 |
| Number of Channels per Chip | 16 |
| Number of Inputs per Chip | 16 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 16 |
| Number of Output Enables per Chip | 4 Low |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 1.1(Typ)@3.3V|1.3(Typ)@2.5V|1.7(Typ)@1.8V|1.8(Typ)@1.5V|2.6(Typ)@1.2V |
| Absolute Propagation Delay Time (ns) | 6.2 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 12 |
| Maximum High Level Output Current (mA) | -12 |
| Minimum Operating Supply Voltage (V) | 1.2 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Tolerant I/Os (V) | 3.6 |
| Typical Quiescent Current (uA) | 0.2 |
| Maximum Quiescent Current (uA) | 40 |
| Propagation Delay Test Condition (pF) | 30 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 1.05(Max) |
| Package Width | 6.2(Max) |
| Package Length | 12.6(Max) |
| PCB changed | 48 |
| Standard Package Name | SO |
| Supplier Package | TSSOP |
| Pin Count | 48 |
