| RoHS (Unión Europea) | Not Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.39.00.60 |
| SVHC | Yes |
| Índice de SEP por encima del límite autorizado | Yes |
| Automotive | No |
| PPAP | No |
| Type | General Purpose |
| Number of Channels per Chip | 1 |
| Maximum Data Rate | 25Mbps |
| Maximum Rise Time (ns) | 3(Typ) |
| Maximum Fall Time (ns) | 3(Typ) |
| Minimum Pulse Width (ns) | 40 |
| Maximum Pulse Width Distortion (ns) | 2 |
| Maximum Propagation Delay Skew (ns) | 8 |
| Output Type | CMOS |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 3 |
| Maximum Propagation Delay Time (tPHL) (ns) | 18 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 18 |
| Maximum Working Insulation Voltage | 560Vp |
| Maximum Quiescent Supply Current (mA) | 0.8/0.06 |
| Maximum Power Dissipation (mW) | 240 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 105 |
| Packaging | Tube |
| Typical Operating Supply Voltage (V) | 3.3|5 |
| Forward/Reverse Channels | 1/0 |
| Minimum Common Mode Rejection (kV/us) | 25 |
| Coupling Type | Magnetic Coupling |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) mm |
| Package Width | 4(Max) mm |
| Package Length | 5(Max) mm |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 8 |
| Lead Shape | Gull-wing |
