| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | 3A991d.1. |
| Estatus de pieza | NRND |
| Código HTS | 8542.31.00.60 |
| Automotive | No |
| PPAP | No |
| Family Name | Cyclone® III |
| User I/Os | 327 |
| Process Technology | 65nm |
| Number of I/O Banks | 8 |
| Operating Supply Voltage (V) | 1.2 |
| Logic Elements | 55856 |
| Number of Multipliers | 156 (18x18) |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 2340 |
| Total Number of Block RAM | 260 |
| IP Core | 10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|V1 ColdFire|Viterbi Compiler, Low-Speed/Hybrid Serial Decoder |
| Provider Name | Altera/Freescale/CAST, Inc/MorethanIP/PLDA |
| Device Logic Units | 55856 |
| Number of Global Clocks | 20 |
| Device Number of DLLs/PLLs | 4 |
| Programmability | No |
| Reprogrammability Support | No |
| Copy Protection | Yes |
| In-System Programmability | No |
| Opr. Frequency (MHz) | 402 |
| Speed Grade | 8 |
| Differential I/O Standards | HSTL-12|HSTL-15|HSTL-18|LVDS|LVPECL|RSDS|SSTL-18|SSTL-2 |
| Single-Ended I/O Standards | HSTL|LVCMOS|LVTTL|PCI|PCI-X|SSTL |
| External Memory Interface | DDR2 SDRAM|QDRII+SRAM |
| Minimum Operating Supply Voltage (V) | 1.15 |
| Maximum Operating Supply Voltage (V) | 1.25 |
| I/O Voltage (V) | 1.2|1.5|1.8|2.5|3.3 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Tradename | Cyclone |
| Mounting | Surface Mount |
| Package Height | 1.75 |
| Package Width | 23 |
| Package Length | 23 |
| PCB changed | 484 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 484 |
| Lead Shape | Ball |
