RoHS (Unión Europea) | Compliant |
ECCN (Estados Unidos) | 3A991b.1.a. |
Estatus de pieza | Active |
Código HTS | 8542.32.00.71 |
Automotive | No |
PPAP | No |
Cell Type | NOR |
Chip Density (bit) | 256M |
Architecture | Sectored |
Boot Block | Yes |
Block Organization | Symmetrical |
Location of Boot Block | Bottom|Top |
Address Width (bit) | 25/24 |
Sector Size | 128Kbyte x 156 |
Page Size | 8Words/16byte |
Number of Bits/Word (bit) | 8/16 |
Number of Words | 32M/16M |
Programmability | Yes |
Timing Type | Asynchronous |
Max. Access Time (ns) | 70 |
Maximum Erase Time (s) | 300/Chip |
Maximum Page Access Time (ns) | 20 |
Maximum Programming Time (ms) | 0.2/Byte |
OE Access Time (ns) | 35 |
Process Technology | CMOS |
Interface Type | Parallel |
Minimum Operating Supply Voltage (V) | 3 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Programming Voltage (V) | 2.7 to 3.6 |
Operating Current (mA) | 45 |
Page Read Current (mA) | 15 |
Program Current (mA) | 40 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 105 |
Supplier Temperature Grade | Extended |
Command Compatible | Yes |
ECC Support | No |
Support of Page Mode | Yes |
Mounting | Surface Mount |
Package Height | 0.8(Max) |
Package Width | 9 |
Package Length | 9 |
PCB changed | 64 |
Standard Package Name | BGA |
Supplier Package | LFBGA |
Pin Count | 64 |
Lead Shape | Ball |