| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.32.00.24 |
| Automotive | No |
| PPAP | No |
| DRAM Type | FPM |
| Chip Density (bit) | 4M |
| Organization | 256Kx16 |
| Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Access Time (ns) | 35 |
| Address Bus Width (bit) | 9 |
| Interface Type | TTL |
| Minimum Operating Supply Voltage (V) | 3 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Operating Current (mA) | 30 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Number of I/O Lines (bit) | 16 |
| Mounting | Surface Mount |
| Package Height | 1.05(Max) |
| Package Width | 10.26(Max) |
| Package Length | 18.51(Max) |
| PCB changed | 40 |
| Standard Package Name | SO |
| Supplier Package | TSOP-II |
| Pin Count | 40 |
| Lead Shape | Gull-wing |
