RoHS (Unión Europea) | Compliant |
ECCN (Estados Unidos) | EAR99 |
Estatus de pieza | Active |
Código HTS | 8542.32.00.36 |
Automotive | No |
PPAP | No |
DRAM Type | DDR2 SDRAM |
Chip Density (bit) | 2G |
Organization | 128Mx16 |
Number of Internal Banks | 8 |
Number of Words per Bank | 16M |
Number of Bits/Word (bit) | 16 |
Data Bus Width (bit) | 16 |
Maximum Clock Rate (MHz) | 800 |
Maximum Access Time (ns) | 0.4 |
Address Bus Width (bit) | 17 |
Interface Type | SSTL_18 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Maximum Operating Supply Voltage (V) | 1.9 |
Operating Current (mA) | 200 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Commercial |
Number of I/O Lines (bit) | 16 |
Mounting | Surface Mount |
Package Height | 1(Max) |
Package Width | 8 |
Package Length | 12.5 |
PCB changed | 84 |
Standard Package Name | BGA |
Supplier Package | TWBGA |
Pin Count | 84 |