| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | NRND |
| Código HTS | 8542.32.00.32 |
| Automotive | No |
| PPAP | No |
| DRAM Type | DDR2 SDRAM |
| Chip Density (bit) | 1G |
| Organization | 128Mx8 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 16M |
| Number of Bits/Word (bit) | 8 |
| Data Bus Width (bit) | 8 |
| Maximum Clock Rate (MHz) | 333 |
| Maximum Access Time (ns) | 0.45 |
| Address Bus Width (bit) | 17 |
| Interface Type | SSTL_18 |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.9 |
| Operating Current (mA) | 220 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 8 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) mm |
| Package Width | 8 mm |
| Package Length | 10.5 mm |
| PCB changed | 60 |
| Standard Package Name | BGA |
| Supplier Package | TW-BGA |
| Pin Count | 60 |
| Lead Shape | Ball |
