RoHS (Unión Europea) | Compliant |
ECCN (Estados Unidos) | EAR99 |
Estatus de pieza | LTB |
Código HTS | 8542.32.00.28 |
Automotive | No |
PPAP | No |
DRAM Type | DDR SDRAM |
Chip Density (bit) | 512M |
Organization | 32Mx16 |
Number of Internal Banks | 4 |
Number of Words per Bank | 8M |
Number of Bits/Word (bit) | 16 |
Data Bus Width (bit) | 16 |
Maximum Clock Rate (MHz) | 200 |
Maximum Access Time (ns) | 0.7 |
Address Bus Width (bit) | 15 |
Process Technology | CMOS |
Interface Type | SSTL_2 |
Minimum Operating Supply Voltage (V) | 2.5 |
Typical Operating Supply Voltage (V) | 2.6 |
Maximum Operating Supply Voltage (V) | 2.7 |
Operating Current (mA) | 430 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 |
Supplier Temperature Grade | Commercial |
Number of I/O Lines (bit) | 16 |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 1.05(Max) |
Package Width | 10.29(Max) |
Package Length | 22.42(Max) |
PCB changed | 66 |
Standard Package Name | SO |
Supplier Package | TSOP-II |
Pin Count | 66 |
Lead Shape | Gull-wing |