| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | General Purpose |
| Process Technology | CMOS |
| Number of Channels per Chip | 4 |
| Maximum Data Rate | 100Mbps |
| Maximum Rise Time (ns) | 4 |
| Maximum Fall Time (ns) | 4 |
| Maximum Pulse Width Distortion (ns) | 4.7 |
| Output Type | CMOS|LVCMOS |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 3 |
| Maximum Propagation Delay Time (tPHL) (ns) | 17.6 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| Maximum Propagation Delay Time (tPLH) (ns) | 17.6 |
| Maximum Working Insulation Voltage | 1414Vp |
| Maximum Output Current Drive (mA) | 15 |
| Maximum Power Dissipation (mW) | 1020 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Typical Operating Supply Voltage (V) | 3.3|5 |
| Forward/Reverse Channels | 3/1 |
| Minimum Common Mode Rejection (kV/us) | 100 |
| Maximum ESD Protection Voltage (kV) | ±2000@HBM |
| Supplier Temperature Grade | Extended |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 2.35(Max) |
| Package Width | 7.6(Max) |
| Package Length | 10.5(Max) |
| PCB changed | 16 |
| Standard Package Name | SO |
| Supplier Package | SOIC |
| Pin Count | 16 |
| Lead Shape | Gull-wing |
