| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | 3A991.b.1.a |
| Estatus de pieza | Active |
| Código HTS | 8542.32.00.71 |
| Automotive | No |
| PPAP | No |
| Cell Type | NAND |
| Chip Density (bit) | 512G |
| Boot Block | Yes |
| Number of Bits/Word (bit) | 1/4/8 |
| Number of Words | 512G/128G/64G |
| Programmability | Yes |
| Timing Type | Synchronous |
| Maximum Erase Time (s) | 0.02 |
| Interface Type | Serial e-MMC |
| Maximum Operating Frequency (MHz) | 200 |
| Minimum Operating Supply Voltage (V) | 1.7|2.7 |
| Typical Operating Supply Voltage (V) | 1.8|3.3 |
| Maximum Operating Supply Voltage (V) | 1.95|3.6 |
| Minimum Operating Temperature (°C) | -25 |
| Maximum Operating Temperature (°C) | 85 |
| Command Compatible | Yes |
| ECC Support | Yes |
| Support of Page Mode | No |
| Mounting | Surface Mount |
| Package Height | 0.71 |
| Package Width | 11.5 |
| Package Length | 13 |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 153 |
| Lead Shape | Ball |
