| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.33.00.01 |
| Automotive | No |
| PPAP | No |
| Type | High Speed Amplifier |
| Manufacturer Type | High Speed Amplifier |
| Number of Channels per Chip | 1 |
| Process Technology | BiCOM |
| Maximum Input Offset Voltage (mV) | 0.6@±15V |
| Minimum Dual Supply Voltage (V) | ±2.5 |
| Typical Dual Supply Voltage (V) | ±3|±5|±9|±12|±15 |
| Maximum Dual Supply Voltage (V) | ±18 |
| Maximum Input Offset Current (uA) | 0.3@±15V |
| Maximum Input Bias Current (uA) | 0.3@±15V |
| Maximum Supply Current (mA) | 10.5@±15V |
| Typical Output Current (mA) | 26@±15V |
| Power Supply Type | Dual |
| Typical Slew Rate (V/us) | 250@±15V |
| Typical Input Noise Voltage Density (nV/rtHz) | 6@±15V |
| Typical Voltage Gain (dB) | 100 |
| Typical Noninverting Input Current Noise Density (pA/rtHz) | 2@±15V |
| Minimum PSRR (dB) | 90 |
| Minimum CMRR (dB) | 92 |
| Minimum CMRR Range (dB) | 90 to 95 |
| Typical Gain Bandwidth Product (MHz) | 150 |
| Typical Settling Time (ns) | 85 |
| Shut Down Support | No |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Temperature Grade | Commercial |
| Packaging | Tube |
| Mounting | Through Hole |
| Package Height | 3.3 mm |
| Package Width | 6.48 mm |
| Package Length | 10.16(Max) mm |
| PCB changed | 8 |
| Standard Package Name | DIP |
| Supplier Package | PDIP N |
| Pin Count | 8 |
| Lead Shape | Through Hole |
