| RoHS (Unión Europea) | Compliant with Exemption |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | I2C|SPI |
| Number of Channels per Chip | 6 |
| Maximum Data Rate | 20Mbps |
| Maximum Rise Time (ns) | 12.5 |
| Maximum Fall Time (ns) | 12.5 |
| Output Type | Logic |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 3 |
| Maximum Propagation Delay Time (tPHL) (ns) | 100 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 100 |
| Maximum Working Insulation Voltage | 560Vp |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Packaging | Tray |
| Typical Operating Supply Voltage (V) | 3.3 |
| Minimum Common Mode Rejection (kV/us) | 30 |
| Maximum ESD Protection Voltage (kV) | ±10(Typ)@HBM |
| Supplier Temperature Grade | Commercial |
| Coupling Type | Magnetic Coupling |
| Mounting | Surface Mount |
| Package Height | 2.82 |
| Package Width | 11.25 |
| Package Length | 15 |
| PCB changed | 32 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| Pin Count | 32 |
| Lead Shape | Ball |
