MC33FS6522LAER2

High Performance System Basis Chip IC Automotive AEC-Q100

NXP Semiconductors

Especificaciones técnicas del producto

• RoHS (Unión Europea)

  Compliant

• ECCN (Estados Unidos)

  EAR99

• Estatus de pieza

  Active

• Código HTS

  8542.39.00.60

• SVHC

  Yes

• Automotive

  Yes

• PPAP

  Yes

• Mounting

  Surface Mount

• Package Height

  1.45(Max) mm

• Package Width

  7 mm

• Package Length

  7 mm

• PCB changed

  48

• Standard Package Name

  QFP

• Supplier Package

  HLQFP EP

• Pin Count

  48

• Lead Shape

  Gull-wing