| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Driver Type | Low Side |
| Driver Configuration | Non-Inverting |
| Bridge Type | Half Bridge |
| Number of Drivers | 2 |
| Type | IGBT|MOSFET |
| Number of Outputs | 2 |
| Maximum Rise Time (ns) | 17 |
| Maximum Fall Time (ns) | 17 |
| Maximum Propagation Delay Time (ns) | 26 |
| Minimum Operating Supply Voltage (V) | 4.5 |
| Maximum Operating Supply Voltage (V) | 18 |
| Maximum Supply Current (mA) | 0.9 |
| Typical Input Low Threshold Voltage (V) | 1.3 |
| Typical Input High Threshold Voltage (V) | 1.6 |
| Peak Output Current (A) | 3(Typ) |
| Output Resistance (Ohm) | 1.6|2.4 |
| Maximum Power Dissipation (mW) | 1000 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Extended |
| Latch-Up Proof | Yes |
| Packaging | Tube |
| Mounting | Surface Mount |
| Package Height | 1.25(Min) mm |
| Package Width | 3.9 mm |
| Package Length | 4.9 mm |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 8 |
