RoHS (Unión Europea) | Compliant |
ECCN (Estados Unidos) | EAR99 |
Estatus de pieza | Active |
Código HTS | 8542.32.00.02 |
Automotive | No |
PPAP | No |
DRAM Type | SDRAM |
Chip Density (bit) | 64M |
Organization | 4Mx16 |
Number of Internal Banks | 4 |
Number of Words per Bank | 1M |
Number of Bits/Word (bit) | 16 |
Data Bus Width (bit) | 16 |
Maximum Clock Rate (MHz) | 167 |
Maximum Access Time (ns) | 17|5.4|7.5 |
Address Bus Width (bit) | 14 |
Process Technology | CMOS |
Interface Type | LVTTL |
Minimum Operating Supply Voltage (V) | 3 |
Typical Operating Supply Voltage (V) | 3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Number of I/O Lines (bit) | 16 |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 1(Max) |
Package Width | 10.16 |
Package Length | 22.22 |
PCB changed | 54 |
Standard Package Name | SO |
Supplier Package | TSOP-II |
Pin Count | 54 |
Lead Shape | Gull-wing |